Patent Assignment
Reel/Frame 045703/0698
Assignment of Assignor's Interest
Recorded: 2018-05-03
Pages: 2
Assignee
RENESAS ELECTRONICS CORPORATION
2-24, TOYOSU 3-CHOME, KOUTOU-KU,, TOKYO, 135-0061, JAPAN
Covered Property
(1)
Method of Packaging Power Semiconductor Module Including Power Transistors