Patent Assignment
Reel/Frame 045717/0106
Assignment of Assignor's Interest
Recorded: 2018-05-04
Pages: 5
Assignors
NOH, JEEHWAN
Executed: 2018-05-02
KIM, TAEYOUNG
Executed: 2018-05-02
YOO, HYUNIL
Executed: 2018-05-02
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, KOREA, REPUBLIC OF
Covered Property
(1)
Method and Apparatus for Beam Association Between Downlink/Uplink