Patent Assignment
Reel/Frame 045734/0766
Assignment of Assignor's Interest
Recorded: 2018-05-07
Pages: 2
Assignors
HUANG, MING-CHI
Executed: 2018-04-17
HUANG, KUO-BIN
Executed: 2018-04-17
CHUANG, YING-LIANG
Executed: 2018-04-27
YEH, MING-HSI
Executed: 2018-04-17
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Footing Removal in Cut-Metal Process