Patent Assignment
Reel/Frame 045740/0436
Assignment of Assignor's Interest
Recorded: 2018-05-08
Pages: 3
Assignors
YU, DE-WEI
Executed: 2018-03-12
CHEN, CHIEN-HAO
Executed: 2018-03-12
PENG, CHIH-TANG
Executed: 2018-03-12
CHEN, JEI MING
Executed: 2018-03-12
WANG, SHU-YI
Executed: 2018-03-12
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, TAIWAN
Covered Property
(1)
Post Uv Cure for Gapfill Improvement
Patent:
10,332,746 →
Application:
15/920,753 →