Patent Assignment
Reel/Frame 045743/0464
Assignment of Assignor's Interest
Recorded: 2018-05-08
Pages: 3
Assignors
TOLENTINO, ERIK NINO
Executed: 2015-01-23
MANIKAM, VEMAL RAJA
Executed: 2015-01-23
ARIPIN, AZHAR
Executed: 2015-01-23
Assignee
SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
5005 E. MCDOWELL ROAD, MAILDROP A700, PHOENIX, ARIZONA, 85008
Covered Property
(1)
Direct Bonded Copper Semiconductor Packages and Related Methods
Related Assignments
(2)
Other recorded transfers of the patent in this record — the chain of ownership.
Patent Security Agreement
Oct 16, 2018
From: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC; FAIRCHILD SEMICONDUCTOR CORPORATION
To: DEUTSCHE BANK AG NEW YORK BRANCH, AS COLLATERAL AGENT
Reel/Frame 047864/0611 →
Release of Security Interest in Patents Recorded at Reel 047864, Frame 0611
Jun 23, 2023
From: DEUTSCHE BANK AG NEW YORK BRANCH, AS COLLATERAL AGENT
To: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC; FAIRCHILD SEMICONDUCTOR CORPORATION
Reel/Frame 064077/0298 →