Patent Assignment
Reel/Frame 045765/0375
Assignment of Assignor's Interest
Recorded: 2018-05-10
Pages: 3
Assignors
PENG, CHIH-I
Executed: 2018-04-27
YEH, HSIU-MING
Executed: 2018-04-27
LIU, YI-CHANG
Executed: 2018-04-27
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
NO. 8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Method and Apparatus for Chemical Mechanical Polishing Process