Patent Assignment
Reel/Frame 045765/0378
Assignment of Assignor's Interest
Recorded: 2018-05-10
Pages: 8
Assignors
KIM, YUN-YOUNG
Executed: 2018-01-17
KIM, PYOUNGWAN
Executed: 2018-01-17
KIM, HYUNKI
Executed: 2018-01-17
PARK, JUNWOO
Executed: 2018-01-17
KIM, SANGSOO
Executed: 2018-01-24
KIM, SEUNG HWAN
Executed: 2018-01-24
PARK, SUNG-KYU
Executed: 2018-01-17
SHIN, INSUP
Executed: 2018-01-24
Assignee
SAMSUNG ELECTRONICS CO., LTD
129, SAMSUNG-RO, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, 16677, KOREA, REPUBLIC OF
Covered Property
(1)
Semiconductor Package Having a Molding Layer Including a Molding Cavity and Method of Fabricating the Same