Patent Assignment
Reel/Frame 045765/0525
Assignment of Assignor's Interest
Recorded: 2018-05-10
Pages: 4
Assignors
CHOU, TIEN-PEI
Executed: 2018-03-09
CHANG, KEN-YU
Executed: 2018-03-09
WANG, CHUN-CHIEH
Executed: 2018-03-09
PAI, YUEH-CHING
Executed: 2018-03-09
LIN, YU-TING
Executed: 2018-03-09
CHENG, YU-WEN
Executed: 2018-03-09
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, TAIWAN
Covered Property
(1)
Semiconductor Device With TiN Adhesion Layer For Forming A Contact Plug