Patent Assignment
Reel/Frame 045769/0508
Assignment of Assignor's Interest
Recorded: 2018-05-10
Pages: 8
Assignors
CHEN, QIANWEN
Executed: 2018-05-09
DANG, BING
Executed: 2018-05-09
BUDD, RUSSELL
Executed: 2018-05-09
WEN, BO
Executed: 2018-05-09
HUNG, LI-WEN
Executed: 2018-05-09
NAH, JAE-WOONG
Executed: 2018-05-09
KNICKERBOCKER, JOHN
Executed: 2018-05-09
Assignee
INTERNATIONAL BUSINESS MACHINES CORPORATION
NEW ORCHARD ROAD, ARMONK, NEW YORK, 10504
Covered Property
(1)
High Speed Handling of Ultra-Small Chips by Selective Laser Bonding and Debonding