Patent Assignment
Reel/Frame 045770/0845
Assignment of Assignor's Interest
Recorded: 2018-05-10
Pages: 9
Assignors
PENG, LAN
Executed: 2018-04-05
KIM, SOON-WOOK
Executed: 2018-04-05
BEYNE, ERIC
Executed: 2018-04-04
BEYER, GERALD PETER
Executed: 2018-04-04
SLEECKX, ERIK
Executed: 2018-04-05
MILLER, ROBERT
Executed: 2018-04-04
Assignee
IMEC VZW
KAPELDREEF 75, LEUVEN, 3001, BELGIUM
Covered Property
(1)
Method of Bonding Semiconductor Substrates