Patent Assignment
Reel/Frame 045773/0360
Assignment of Assignor's Interest
Recorded: 2018-05-10
Pages: 8
Assignors
TSAI, TSANG-I
Executed: 2018-05-08
LIN, YI-SHEN
Executed: 2018-05-08
HSU, MIN-WEI
Executed: 2018-05-08
YU, CHEN-XI
Executed: 2018-05-08
Assignee
TIANJIN LAIRD TECHNOLOGIES LIMITED
BUILDING C3 & C4, HONG TAI INDUSTRY PARK, NO. 87 TAIFENG ROAD, TEDA, TIANJIN, 300457, CHINA
Covered Property
(1)
Systems and Methods of Applying Materials to Components
Related Assignments
(3)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest
May 17, 2018
From: TIANJIN LAIRD TECHNOLOGIES LIMITED
To: LAIRD TECHNOLOGIES, INC.
Reel/Frame 045834/0897 →
Security Interest
Nov 3, 2025
From: QNITY ELECTRONICS, INC.
To: JPMORGAN CHASE BANK, N.A., AS COLLATERAL AGENT
Reel/Frame 073515/0243 →
Security Interest
Nov 3, 2025
From: QNITY ELECTRONICS, INC.
To: U.S. BANK TRUST COMPANY, NATIONAL ASSOCIATION, AS NOTES COLLATERAL AGENT
Reel/Frame 073517/0298 →