Patent Assignment
Reel/Frame 045813/0037
Assignment of Assignor's Interest
Recorded: 2018-05-15
Pages: 4
Assignors
CHENG, CHIA-MING
Executed: 2018-05-07
LEE, PO-HAN
Executed: 2018-05-07
YANG, WEI-CHUNG
Executed: 2018-05-07
WU, KUAN-JUNG
Executed: 2018-05-07
CHANG, SHU-MING
Executed: 2018-05-07
Assignee
XINTEC INC.
9F., NO. 23, JILIN RD., JHONGLI INDUSTRIAL PARK, JHONGLI DIST., TAOYUAN CITY, 32062, TAIWAN
Covered Property
(1)
Chip Package and Method for Forming the Same