Patent Assignment
Reel/Frame 045816/0238
Assignment of Assignor's Interest
Recorded: 2018-05-16
Pages: 11
Assignors
WADA, NORIO
Executed: 2018-04-27
KOHAMA, NORIFUMI
Executed: 2018-05-08
MOTODA, KIMIO
Executed: 2018-04-16
Assignee
TOKYO ELECTRON LIMITED
3-1, AKASAKA 5-CHOME, MINATO-KU, TOKYO, 107-6325, JAPAN
Covered Property
(1)
Bonding Apparatus and Bonding Method