Patent Assignment
Reel/Frame 045824/0858
Assignment of Assignor's Interest
Recorded: 2018-05-16
Pages: 6
Assignors
HUNG, CHIH-CHANG
Executed: 2018-01-05
CHEN, CHIA-JEN
Executed: 2018-01-08
CHANG, MING-CHING
Executed: 2018-01-05
KU, SHU-YUAN
Executed: 2018-01-05
HSIAO, YI-HSUAN
Executed: 2018-03-25
YANG, I-WEI
Executed: 2018-01-08
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, TAIWAN
Covered Property
(1)
Semiconductor Structure Cutting Process and Structures Formed Thereby
Patent:
10,867,998 →
Application:
15/860,492 →