Patent Assignment
Reel/Frame 045831/0892
Assignment of Assignor's Interest
Recorded: 2018-05-17
Pages: 3
Assignors
LIM, SEOK LING
Executed: 2017-04-28
ONG, JENNY SHIO YIN
Executed: 2017-04-28
CHEAH, BOK ENG
Executed: 2017-04-28
KONG, JACKSON CHUNG PENG
Executed: 2017-04-28
Assignee
INTEL CORPORATION
2200 MISSION COLLEGE BOULEVARD, SANTA CLARA, CALIFORNIA, 95054
Covered Property
(1)
Integrated Circuit Packages with Conductive Element Having Cavities Housing Electrically Connected Embedded Components