Patent Assignment
Reel/Frame 045855/0483
Assignment of Assignor's Interest
Recorded: 2018-05-21
Pages: 7
Assignors
KASAI, RYOHEI
Executed: 2018-05-13
FURUKAWA, TADASHI
Executed: 2018-04-16
FURUGEN, RYO
Executed: 2018-04-16
SOTODA, TEPPEI
Executed: 2018-04-19
HOSODA, TETSUSHI
Executed: 2018-04-18
FURUSE, AYAKO
Executed: 2018-04-23
Assignee
DAI NIPPON PRINTING CO., LTD.
1-1, ICHIGAYA-KAGA-CHO 1-CHOME, SHINJUKU-KU, TOKYO-TO, JAPAN
Covered Property
(1)
Wiring Structure and Method of Manufacturing the Same, Semiconductor Device, Multilayer Wiring Structure and Method of Manufacturing the Same, Semiconductor Element Mounting Substrate, Method of Forming Pattern Structure, Imprint Mold and Method of Manufacturing the Same, Imprint Mold Set, and Method of Manufacturing Multilayer Wiring Board
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.