IP Library › Assignment 045857/0237
Patent Assignment
Reel/Frame 045857/0237

Assignment of Assignor's Interest

Recorded: 2018-04-04 Pages: 3
Assignor
RANAWEERA, JEEWIKA
Executed: 2018-04-03
Assignee
ORACLE INTERNATIONAL CORPORATION
500 ORACLE PARKWAY, REDWOOD SHORES, CALIFORNIA, 94065
Covered Property (1)
Warping Reduction in Silicon Wafers
Application: 15/945,665 →
Publication: US 2019/0311995