Patent Assignment
Reel/Frame 045860/0832
Assignment of Assignor's Interest
Recorded: 2018-05-21
Pages: 3
Assignor
DI, YUNPING
Executed: 2018-04-09
Assignee
BOE TECHNOLOGY GROUP CO., LTD.
NO.10 JIUXIANQIAO RD., CHAOYANG DISTRICT, BEIJING, 100015, CHINA
Covered Property
(1)
Method for Manufacturing Array Substrate, Array Substrate and Fingerprint Recognition Device