Patent Assignment
Reel/Frame 045863/0587
Assignment of Assignor's Interest
Recorded: 2018-05-21
Pages: 4
Assignors
MURAKAMI, YASUHARU
Executed: 2014-07-01
YAMAZAKI, HIROSHI
Executed: 2014-07-01
IGARASHI, YOSHIMI
Executed: 2014-07-01
SASAHARA, NAOKI
Executed: 2014-06-24
MUKAI, IKUO
Executed: 2014-06-24
Assignee
HITACHI CHEMICAL COMPANY, LTD.
9-2, MARUNOUCHI 1-CHOME, CHIYODA-KU, TOKYO, 100-6606, JAPAN
Covered Property
(1)
Method for Forming Resin Cured Film Pattern, Photosensitive Resin Composition, Photosensitive Element, Method for Producing Touch Panel, and Resin Cured Film
Related Assignments
(3)
Other recorded transfers of the patent in this record — the chain of ownership.
Change of Name
Mar 2, 2023
From: HITACHI CHEMICAL COMPANY, LTD.
To: SHOWA DENKO MATERIALS CO., LTD.
Reel/Frame 062917/0865 →
Change of Name
Mar 3, 2023
From: SHOWA DENKO MATERIALS CO., LTD.
To: RESONAC CORPORATION
Reel/Frame 062946/0125 →
Change of Address
Feb 14, 2024
From: RESONAC CORPORATION
To: RESONAC CORPORATION
Reel/Frame 066599/0037 →