Patent Assignment
Reel/Frame 045881/0095
Assignment of Assignor's Interest
Recorded: 2018-05-23
Pages: 3
Assignor
SEKIYA, KAZUMA
Executed: 2018-05-02
Assignee
DISCO CORPORATION
13-11, OMORI-KITA 2-CHOME, OTA-KU,, TOKYO, 143-8580, JAPAN
Covered Property
(1)
Wafer Processing Method