Patent Assignment
Reel/Frame 045897/0824
Assignment of Assignor's Interest
Recorded: 2018-05-24
Pages: 4
Assignors
TANAKA, HARUMI
Executed: 2018-04-20
OSHIYAMA, ITARU
Executed: 2018-04-20
YOKOGAWA, SOZO
Executed: 2018-04-20
Assignee
SONY SEMICONDUCTOR SOLUTIONS CORPORATION
4-14-1 ASAHI-CHO, ATSUGI-SHI, KANAGAWA, 2430014, JAPAN
Covered Property
(1)
Solid-State Image Pickup Element, Image Pickup Device, and Method of Manufacturing Solid-State Image Pickup Element