Patent Assignment
Reel/Frame 045898/0316
Assignment of Assignor's Interest
Recorded: 2018-05-24
Pages: 5
Assignors
LEE, JEONG IL
Executed: 2018-05-17
LEE, JEONG HO
Executed: 2018-05-17
KIM, JIN SU
Executed: 2018-05-17
CHO, BONG JU
Executed: 2018-05-17
Assignee
SAMSUNG ELECTRO-MECHANICS CO., LTD.
MAEYOUNG-RO 150 (MAETAN-DONG), YOUNGTONG-GU, SUWON-SI, GYEONGGI-DO, KOREA, REPUBLIC OF
Covered Property
(1)
Fan-Out Semiconductor Package
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.