Patent Assignment
Reel/Frame 045898/0600
Assignment of Assignor's Interest
Recorded: 2018-05-24
Pages: 4
Assignors
JENG, SHIN-PUU
Executed: 2018-04-27
CHEN, SHUO-MAO
Executed: 2018-04-27
LIU, HSIEN-WEN
Executed: 2018-04-27
CHUANG, PO-YAO
Executed: 2018-04-27
HSU, FENG-CHENG
Executed: 2018-04-27
LIN, PO-YAO
Executed: 2018-04-27
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
8, LI-HSIN RD. 6 HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Semiconductor Package with Redistribution Structure and Pre-made Substrate on Opposing Sides for Dual-Side Metal Routing