Patent Assignment
Reel/Frame 045900/0046
Assignment of Assignor's Interest
Recorded: 2018-05-25
Pages: 5
Assignor
MEMSENSING MICROSYSTEMS TECHNOLOGY CO., LTD.
Executed: 2018-05-23
Assignee
MEMSENSING MICROSYSTEMS (SUZHOU, CHINA) CO., LTD.
SUITE 501, BUILDING NW-09, 99 JIN JI HU ROAD, SUZHOU INDUSTRIAL PARK, SUZHOU CITY, JIANGSU PROVINCE, 215123, CHINA
Covered Properties
(5)
Methods for Manufacturing Mems Sensor and Thin Film and Cantilever Beam Thereof with Epitaxial Growth Process
Patent:
7,972,888 →
Application:
12/813,503 →
Feedback System for Identifying Movement and Intensity of External Force
Methods for Manufacturing Mems Sensor and Thin Film Thereof with Improved Etching Process
Patent:
7,998,776 →
Application:
12/910,801 →
Transverse Acoustic Wave Resonator, Oscillator Having the Resonator and Method for Making the Resonator
Chip with Integrated Circuit and Micro-Silicon Condenser Microphone Integrated on Single Substrate and Method for Making the Same
Related Assignments
(5)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest
Jun 11, 2010
From: LI, GANG; HU, WEI
To: MEMSENSING MICROSYSTEMS TECHNOLOGY CO., LTD.
Reel/Frame 024519/0366 →
Assignment of Assignor's Interest
Oct 23, 2010
From: MEI, JIA-XIN; LI, GANG; YANG, HONG-YUAN
To: MEMSENSING MICROSYSTEMS TECHNOLOGY CO., LTD.
Reel/Frame 025184/0793 →
Assignment of Assignor's Interest
Oct 23, 2010
From: LI, GANG; HU, WEI
To: MEMSENSING MICROSYSTEMS TECHNOLOGY CO., LTD.
Reel/Frame 025184/0805 →
Assignment of Assignor's Interest
Dec 2, 2011
From: XIAO, BIN; LV, PING; HU, WEI; MEI, JIA-XIN
To: MEMSENSING MICROSYSTEMS TECHNOLOGY CO., LTD.
Reel/Frame 027326/0897 →
Assignment of Assignor's Interest
Jul 30, 2012
From: HU, WEI; LI, GANG; MEI, JIA-XIN
To: MEMSENSING MICROSYSTEMS TECHNOLOGY CO., LTD
Reel/Frame 028671/0328 →