Patent Assignment
Reel/Frame 045912/0790
Assignment of Assignor's Interest
Recorded: 2018-05-29
Pages: 6
Assignors
KIM, SANG-UK
Executed: 2018-01-25
KIM, SUNCHUL
Executed: 2018-01-25
SEOL, JINKYEONG
Executed: 2018-01-25
JANG, BYOUNG WOOK
Executed: 2018-01-25
Assignee
SAMSUNG ELECTRONICS CO., LTD
129, SAMSUNG-RO, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, 16677, KOREA, REPUBLIC OF
Covered Property
(1)
Semiconductor Packages and Methods of Manufacturing Same