Patent Assignment
Reel/Frame 045926/0875
Assignment of Assignor's Interest
Recorded: 2018-05-30
Pages: 5
Assignors
HSU, SEN-KUEI
Executed: 2018-05-22
YANG, CHING-FENG
Executed: 2018-05-22
PAN, HSIN-YU
Executed: 2018-05-22
WU, KAI-CHIANG
Executed: 2018-05-22
CHIANG, YI-CHE
Executed: 2018-05-22
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
NO.8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK,, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Semiconductor Packages Having Thermal Through Vias (Ttv)