Patent Assignment
Reel/Frame 045932/0077
Assignment of Assignor's Interest
Recorded: 2018-05-30
Pages: 3
Assignors
HAN, JUNG HOON
Executed: 2018-05-24
PARK, EUN TAE
Executed: 2018-05-25
HA, JIN HO
Executed: 2018-05-24
YONG, JUN WOO
Executed: 2018-05-24
Assignee
WISOL CO., LTD.
(GAJSNG-DONG) 531-7, GAJANG-RO, OSAN-SI, GYEONGGI-DO, 447-210, KOREA, REPUBLIC OF
Covered Property
(1)
Wafer Level Package and Manufacturing Method Thereof