Patent Assignment
Reel/Frame 045936/0942
Assignment of Assignor's Interest
Recorded: 2018-05-30
Pages: 6
Assignors
YANG, YI
Executed: 2018-03-20
SHEN, DONGNA
Executed: 2018-03-20
TENG, ZHONGJIAN
Executed: 2018-03-20
HAQ, JESMIN
Executed: 2018-03-20
WANG, YU-JEN
Executed: 2018-03-20
Assignee
HEADWAY TECHNOLOGIES, INC
678 S. HILLVIEW DRIVE, MILPITAS, CALIFORNIA, 95035
Covered Property
(1)
Ion Beam Etching Fabricated Sub 30nm Vias to Reduce Conductive Material Re-Deposition for Sub 60nm MRAM Devices
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.