Patent Assignment
Reel/Frame 045946/0811
Assignment of Assignor's Interest
Recorded: 2018-05-31
Pages: 3
Assignee
RENESAS ELECTRONICS CORPORATION
2-24, TOYOSU 3-CHOME, KOUTOU-KU, TOKYO, 135-0061, JAPAN
Covered Property
(1)
Semiconductor Device with Over Pad Metal Electrode and Method for Manufacturing the Same