Patent Assignment
Reel/Frame 045955/0634
Assignment of Assignor's Interest
Recorded: 2018-05-31
Pages: 3
Assignor
TANAKA, MAKOTO
Executed: 2018-05-07
Assignee
DISCO CORPORATION
13-11, OMORI-KITA 2-CHOME, OTA-KU,, TOKYO, 143-8580, JAPAN
Covered Property
(1)
Processing Method for Sector-Shaped Wafer Piece