Patent Assignment
Reel/Frame 045971/0677
Assignment of Assignor's Interest
Recorded: 2018-06-04
Pages: 7
Assignors
LEE, DONG GUN
Executed: 2018-05-18
KIM, YONG IL
Executed: 2018-05-23
SEONG, HAN KYU
Executed: 2018-05-23
YEON, JI HYE
Executed: 2018-05-24
LEE, JIN SUB
Executed: 2018-05-23
CHOI, YOUNG JIN
Executed: 2018-05-23
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129 SAMSUNG-RO, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, 16677, KOREA, REPUBLIC OF
Covered Property
(1)
Light Emitting Device Package Including Light Emitting Devices, Light-Transmissive Substrate, and Eutectic Bonding Layer Interposed Therebetween and Display Device Using the Same