Patent Assignment
Reel/Frame 045989/0133
Assignment of Assignor's Interest
Recorded: 2018-06-05
Pages: 2
Assignors
WEI, WEN-HSIN
Executed: 2018-05-30
HU, HSIEN-PIN
Executed: 2018-05-30
HOU, SHANG-YUN
Executed: 2018-05-30
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Chip Package Having Die Structures of Different Heights and Method of Forming Same