Patent Assignment
Reel/Frame 045997/0712
Assignment of Assignor's Interest
Recorded: 2018-06-06
Pages: 2
Assignee
LINTEC CORPORATION
23-23, HONCHO, ITABASHI-KU, TOKYO, 173-0001, JAPAN
Covered Property
(1)
Base Film for Sheets for Semiconductor Wafer Processing, Sheet for Semiconductor Wafer Processing, and Method of Manufacturing Semiconductor Devices