Patent Assignment
Reel/Frame 046022/0899
Assignment of Assignor's Interest
Recorded: 2018-04-26
Pages: 2
Assignors
WANG, PO-HAN
Executed: 2018-03-30
KUO, HUNG-JUI
Executed: 2018-03-30
HU, YU-HSIANG
Executed: 2018-03-30
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Semiconductor Package and Method