Patent Assignment
Reel/Frame 046037/0430
Assignment of Assignor's Interest
Recorded: 2018-06-10
Pages: 3
Assignors
ARAI, DAISUKE
Executed: 2018-04-23
KITADA, MIZUE
Executed: 2018-04-23
ASADA, TAKESHI
Executed: 2018-04-23
YAMAGUCHI, TAKESHI
Executed: 2018-04-23
SUZUKI, NORIAKI
Executed: 2018-04-28
Assignee
SHINDENGEN ELECTRIC MANUFACTURING CO., LTD.
2-1, OHTEMACHI 2-CHOME, CHIYODA-KU, TOKYO, 100-0004, JAPAN
Covered Property
(1)
Power Semiconductor Device and Method of Manufacturing Power Semiconductor Device