Patent Assignment
Reel/Frame 046050/0129
Assignment of Assignor's Interest
Recorded: 2018-06-12
Pages: 3
Assignors
YANG, KUO-NAN
Executed: 2018-03-27
LO, WAN-YU
Executed: 2018-03-23
WANG, CHUNG-HSING
Executed: 2018-04-23
BISWAS, HIRANMAY
Executed: 2018-03-23
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.
NO.8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, TAIWAN
Covered Property
(1)
Method and System of Forming Semiconductor Device