Patent Assignment
Reel/Frame 046062/0806
Assignment of Assignor's Interest
Recorded: 2018-06-12
Pages: 12
Assignors
SHIBATA, MASAHIRO
Executed: 2018-05-18
TOKUDA, DAISUKE
Executed: 2018-05-17
KUROKAWA, ATSUSHI
Executed: 2018-05-18
TOKUYA, HIROAKI
Executed: 2018-05-22
UMEMOTO, YASUNARI
Executed: 2018-05-17
Assignee
MURATA MANUFACTURING CO., LTD.
10-1, HIGASHIKOTARI 1-CHOME, NAGAOKAKYO-SHI, KYOTO-FU, 617-8555, JAPAN
Covered Property
(1)
Semiconductor Chip