IP Library › Assignment 046071/0614
Patent Assignment
Reel/Frame 046071/0614

Assignment of Assignor's Interest

Recorded: 2018-06-13 Pages: 2
Assignors
KUO, CHIA-PANG
Executed: 2018-06-04
LEE, YA-LIEN
Executed: 2018-06-04
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property (1)
Barrier Layer Formation for Conductive Feature
Application: 15/993,751 →
Publication: US 2019/0371660