Patent Assignment
Reel/Frame 046079/0548
Assignment of Assignor's Interest
Recorded: 2018-06-13
Pages: 3
Assignor
LU, WEN-LONG
Executed: 2018-06-12
Assignee
ADVANCED SEMICONDUCTOR ENGINEERING, INC.
26 CHIN 3RD ROAD, NANTZE EXPORT PROCESSING ZONE, KAOHSIUNG, TAIWAN
Covered Property
(1)
Semiconductor Package Device and Method of Manufacturing the Same