Semiconductor package device and method of manufacturing the same
A semiconductor package device is provided that includes a first circuit layer having a first conductive layer and a first stud bump and a second circuit layer having a second conductive layer and a second stud bump. The first stud bump has a first portion and a second portion, and the second portion of the first stud bump is electrically connected to the second conductive layer. The second stud bump has a first portion and a second portion, and the second portion of the second stud bump is electrically connected to the first conductive layer. The first stud bump partially overlaps the second stud bump in a direction substantially perpendicular to the first circuit layer.
1. A semiconductor package device, comprising:
a first circuit layer having a first conductive layer and a first stud bump; and
a second circuit layer having a second conductive layer and a second stud bump, wherein
the first stud bump has a first portion and a second portion, and the second portion of the first stud bump is electrically connected to the second conductive layer;
the second stud bump has a first portion and a second portion, and the second portion of the second stud bump is electrically connected to the first conductive layer;
the first stud bump partially overlaps the second stud bump in a direction substantially perpendicular to the first circuit layer; and
the first portion of the first stud bump is spaced apart from the first conductive layer at a first distance, and the first distance is equal to or less than 5 micrometers (μm).
2. The semiconductor package device of claim 1 , wherein the first distance is equal to or greater than 2 μm.
3. The semiconductor package device of claim 1 , wherein the first portion of the second stud bump is spaced apart from the second conductive layer at a second distance, and the second distance is substantially equal to the first distance.
4. The semiconductor package device of claim 1 , wherein a width of the first portion of the first stud bump is greater than a width of the second portion of the first stud bump.
5. The semiconductor package device of claim 1 , wherein d<D−2(t/tan θ);
where d is the width of an interface between the second portion of the first stud bump and the second conductive layer, D is the width of a bottom surface the first stud bump, t is the distance between the interface and the bottom surface the first stud bump, and θ is the angle defined by the bottom surface of the first stud bump and a surface connecting the widest portion of the first stud bump and the edge of the bottom surface of the first stud bump.
6. The semiconductor package device of claim 1 , further comprising a passivation layer disposed between the first circuit layer and the second layer and covering the first stud bump and the second stud bump.
7. The semiconductor package device of claim 1 , wherein
the first circuit layer further comprises a passivation layer, the passivation layer having a first surface facing toward the second circuit layer and a second surface opposite to the first surface;
the first conductive layer is disposed on the first surface of the passivation layer; and
at least a portion of the first portion of the first stud bump is embedded within the passivation layer.
8. The semiconductor package device of claim 7 , wherein the second surface of the passivation layer defines a recess to expose the portion of the first portion of the first stud bump.
9. The semiconductor package device of claim 8 , further comprising a third conductive layer disposed on the second surface of the passivation layer and electrically connected to the exposed portion of the first portion of the first stud bump.
10. The semiconductor package device of claim 9 , further comprising:
a die electrically connected to the third conductive layer; and
a second package body disposed on the second surface of the passivation layer and covering the die and the third conductive layer.
11. A semiconductor package device, comprising:
a first circuit layer having a first conductive layer and a first stud bump; and
a second circuit layer having a second conductive layer and a second stud bump, wherein
the first stud bump has a first portion and a second portion, and the second portion of the first stud bump is electrically connected to the second conductive layer;
the second stud bump has a first portion and a second portion, and the second portion of the second stud bump is electrically connected to the first conductive layer, wherein d<D−2(t/tan θ);
where d is the width of an interface between the second portion of the first stud bump and the second conductive layer, D is the width of a bottom surface the first stud bump, t is the distance between the interface and the bottom surface the first stud bump, and θ is the angle defined by the bottom surface of the first stud bump and a surface connecting the widest portion of the first stud bump and the edge of the bottom surface of the first stud bump.
12. The semiconductor package device of claim 11 , wherein the first portion of the first stud bump is spaced apart from the first conductive layer at a first distance, and the first distance is equal to or less than 5 micrometers (μm).
13. The semiconductor package device of claim 12 , wherein the first distance is equal to or greater than 2 μm.
14. The semiconductor package device of claim 12 , wherein the first portion of the second stud bump is spaced apart from the second conductive layer at a second distance, and the second distance is substantially equal to the first distance.
15. The semiconductor package device of claim 11 , wherein a width of the first portion of the first stud bump is greater than a width of the second portion of the first stud bump.
16. A semiconductor package device, comprising:
a first circuit layer having a first conductive layer and a first stud bump; and
a second circuit layer having a second conductive layer and a second stud bump, wherein
the first stud bump has a first portion and a second portion, and the second portion of the first stud bump is electrically connected to the second conductive layer;
wherein a width of the widest portion of the first stud bump is greater than a width of an interface between the second portion of the first stud bump and the second conductive layer, and wherein the first portion of the first stud bump is spaced apart from the first conductive layer at a first distance, and the first distance is equal to or less than 5 micrometers (μm).
17. The semiconductor package device of claim 16 , wherein:
the second stud bump has a first portion and a second portion, and the second portion of the second stud bump is electrically connected to the first conductive layer; and
a width of the widest portion of the second stud bump is greater than a width of an interface between the second portion of the second stud bump and the first conductive layer.
18. The semiconductor package device of claim 17 , wherein the first portion of the second stud bump is spaced apart from the second conductive layer at a second distance, and the second distance is substantially equal to the first distance.
19. The semiconductor package device of claim 16 , wherein
the first circuit layer further comprises a passivation layer, the passivation layer having a first surface facing toward the second circuit layer and a second surface opposite to the first surface;
the first conductive layer is disposed on the first surface of the passivation layer;
at least a portion of the first portion of the first stud bump is embedded within the passivation layer; and
the second surface of the passivation layer defines a recess to expose the portion of the first portion of the first stud bump.
20. The semiconductor package device of claim 19 , further comprising a third conductive layer disposed on the second surface of the passivation layer and electrically connected to the exposed portion of the first portion of the first stud bump.