Patent Assignment
Reel/Frame 046080/0662
Assignment of Assignor's Interest
Recorded: 2018-06-13
Pages: 6
Assignors
OYAMADA, TETSUYA
Executed: 2018-05-15
UNO, TOMOHIRO
Executed: 2018-05-15
ODA, DAIZO
Executed: 2018-05-10
YAMADA, TAKASHI
Executed: 2018-05-10
Assignees
NIPPON STEEL & SUMIKIN MATERIALS CO., LTD.
16-3, GINZA 7-CHOME, CHUO-KU, TOKYO, 104-0061, JAPAN
NIPPON MICROMETAL CORPORATION
158-1 OAZA SAYAMAGAHARA, IRUMA-SHI, SAITAMA, 358-0032, JAPAN
Covered Property
(1)
Bonding Wire for Semiconductor Device
Related Assignments
(2)
Other recorded transfers of the patent in this record — the chain of ownership.
Merger and Change of Name
May 15, 2019
From: NIPPON STEEL & SUMIKIN MATERIALS CO., LTD.; NIPPON STEEL CHEMICAL & MATERIAL CO., LTD.
To: NIPPON STEEL CHEMICAL & MATERIAL CO., LTD.
Reel/Frame 049191/0603 →
Change of Address for Nippon Steel Chemical & Material Co., Ltd.
Nov 22, 2019
From: NIPPON STEEL CHEMICAL & MATERIAL CO., LTD.
To: NIPPON STEEL CHEMICAL & MATERIAL CO., LTD.
Reel/Frame 051095/0001 →