Patent Assignment
Reel/Frame 046081/0354
Assignment of Assignor's Interest
Recorded: 2018-06-13
Pages: 4
Assignor
TSAI, BO-TSUNG
Executed: 2018-05-10
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
NO.8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK,, HSINCHU, 30078, TAIWAN
Covered Property
(1)
Hybrid Bonded Structure