Patent Assignment
Reel/Frame 046083/0073
Assignment of Assignor's Interest
Recorded: 2018-05-07
Pages: 4
Assignors
WEN, TSENG-FENG
Executed: 2018-04-26
ZENG, WEIGUO
Executed: 2018-04-26
WU, HAIJUAN
Executed: 2018-04-26
CHENG, LIN
Executed: 2018-04-26
Assignee
TRANSOUND ELECTRONICS CO., LTD.
3RD INDUSTRIAL ZONE, SIJIA VILLAGE, SHIJIE TOWN, DONGGUAN CITY, GUANGDONG, 523000, CHINA
Covered Property
(1)
In-Ear Headphone Having Mmcx Socket and Detachable in-Ear Headphone Assembly