Patent Assignment
Reel/Frame 046087/0298
Assignment of Assignor's Interest
Recorded: 2018-06-14
Pages: 6
Assignors
LEE, EUI BOK
Executed: 2018-06-04
BAEK, JONG MIN
Executed: 2018-06-04
AHN, SANG HOON
Executed: 2018-06-04
OH, HYEOK SANG
Executed: 2018-06-04
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU,, SUWON-SI, GYEONGGI-DO,, 16677, KOREA, REPUBLIC OF
Covered Property
(1)
Semiconductor Device Including via Plug and Method of Forming the Same