Patent Assignment
Reel/Frame 046118/0950
Assignment of Assignor's Interest
Recorded: 2018-06-18
Pages: 6
Assignors
KIM, BONG-SOO
Executed: 2017-12-26
PARK, JEMIN
Executed: 2017-12-26
HWANG, YOOSANG
Executed: 2017-12-26
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU, GYEONGGI-DO, SUWON-SI, 16677, KOREA, REPUBLIC OF
Covered Property
(1)
Semiconductor Device Includes a Substrate Having Conductive Contact Structures Thereon