Patent Assignment
Reel/Frame 046120/0726
Assignment of Assignor's Interest
Recorded: 2018-06-18
Pages: 5
Assignors
YU, JIA
Executed: 2018-06-11
ISHIBASHI, NAOTO
Executed: 2018-06-11
FUKADA, KEISUKE
Executed: 2018-06-11
UTASHIRO, TOMOYA
Executed: 2018-06-11
ATSUMI, HIRONORI
Executed: 2018-06-11
Assignee
SHOWA DENKO K.K.
13-9, SHIBADAIMON 1-CHOME, MINATO-KU, TOKYO, 105-8518, JAPAN
Covered Property
(1)
Wafer Supporting Mechanism, Chemical Vapor Deposition Apparatus, and Epitaxial Wafer Manufacturing Method
Related Assignments
(2)
Other recorded transfers of the patent in this record — the chain of ownership.