Patent Assignment
Reel/Frame 046123/0982
Assignment of Assignor's Interest
Recorded: 2018-06-19
Pages: 3
Assignors
BISWAS, HIRANMAY
Executed: 2018-04-26
YANG, KUO-NAN
Executed: 2018-05-22
WANG, CHUNG-HSING
Executed: 2018-05-25
LEE, MENG-XIANG
Executed: 2018-05-08
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.
NO.8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, TAIWAN
Covered Property
(1)
Integrated Device and Method of Forming the Same