Patent Assignment
Reel/Frame 046132/0678
Assignment of Assignor's Interest
Recorded: 2018-06-19
Pages: 4
Assignee
SHOWA DENKO K.K.
13-9, SHIBADAIMON 1-CHOME, MINATO-KU, TOKYO, 105-8518, JAPAN
Covered Property
(1)
Method for Producing Sic Epitaxial Wafer Including Forming Epitaxial Layer Under Different Conditions
Related Assignments
(2)
Other recorded transfers of the patent in this record — the chain of ownership.