Patent Assignment
Reel/Frame 046138/0505
Assignment of Assignor's Interest
Recorded: 2018-05-14
Pages: 2
Assignor
HITACHI, LTD.
Executed: 2018-02-20
Assignee
DENSO CORPORATION
1-1 SHOWA-CHO, KARIYA-CITY, AICHI-PREF, 448-8661, JAPAN
Covered Property
(1)
Sic Semiconductor Device and Method for Manufacturing the Same
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.