Patent Assignment
Reel/Frame 046144/0793
Assignment of Assignor's Interest
Recorded: 2018-06-20
Pages: 5
Assignors
HSIAO, ETHAN
Executed: 2018-06-05
LAI, CHIEN WEN
Executed: 2018-06-05
LAI, CHIH-MING
Executed: 2018-06-05
LIN, YI-HSIUNG
Executed: 2018-06-05
CHUANG, CHENG-CHI
Executed: 2018-06-05
CHEN, HSIN-PING
Executed: 2018-06-05
LIU, RU-GUN
Executed: 2018-06-05
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Methods of Forming Metal Layer Structures in Semiconductor Devices